Блог компании In Stock | Xilinx Zynq UltraScale+ XCZU21DR-2FFVD1156I Industrial-Grade RF SoC

Shenzhen Mingjiada Electronics Co., Ltd. (https://www.integrated-ic.com/), a premier distributor with over 20 years of experience in the electronic components supply chain, has recently received a large shipment of the core model XCZU21DR-2FFVD1156I from the Xilinx (AMD) Zynq UltraScale+ RFSoC series, which is currently in short supply on the market.

This model is an industrial-grade (Grade I) temperature version, supporting a wide operating temperature range of -40°C to +100°C, making it particularly suitable for harsh environments such as outdoor base stations, automotive applications, and military use. We offer highly competitive market prices and professional logistics solutions, committed to resolving the “chip shortage” challenges faced by communications equipment manufacturers and data center customers.

Product Overview: Why Choose the XCZU21DR-2FFVD1156I?

The XCZU21DR-2FFVD1156I belongs to Xilinx’s latest Zynq UltraScale+ RFSoC (Radio Frequency System-on-Chip) family and is manufactured using a 16nm FinFET process. Hailed by the industry as a “milestone in single-chip adaptive RF platforms,” this series integrates high-performance ARM processors, programmable logic (FPGA), and broadband RF data converters.

Key Technical Specifications

I. Processing System (PS) - Heterogeneous Computing Cores

Application Processor: Quad-core ARM Cortex-A53, 64-bit, 1.5GHz

Real-time Processor: Dual-core ARM Cortex-R5F, 32-bit, 600MHz

On-chip Memory: 256KB RAM (with ECC), supports DDR4-2666

Peripheral Interfaces: PCIe Gen3, USB 3.0, SATA 3.0, Gigabit Ethernet

II. Programmable Logic (PL) – UltraScale Architecture

Logic Cells: 930,300 (approx. 930,000)

LUTs (Lookup Tables): 176,000

DSP Slices: 768, supporting 27×18 multiply-accumulate operations

Block RAM (BRAM): 9.3 Mb

Distributed RAM: 13 Mb

High-Speed Transceivers (GTY): 16 channels, up to 32.75 Gbps per channel

III. RF Data Converter Subsystem (RFSoC Core)

RF-ADC: 4 channels, 14-bit, up to 5 GSPS, direct RF sampling (0.2–6 GHz)

RF-DAC: 4 channels, 14-bit, up to 9.85 GSPS, direct RF output

Integrated Functions: DDC/DUC (Digital Downconverter/Upconverter), NCO, programmable filtering

IV. Electrical and Environmental Parameters

Core Voltage: PS 0.85V / PL 0.9V

Operating Temperature: -40°C to +100°C (Industrial Grade I)

Package: FCBGA-1156 (FFVD1156), 35×35mm

Typical Power Consumption: 15–25W (Depending on configuration)

ECCN Code: 5A002.A.4 (High-Control Item)

Applications

5G/6G Wireless Base Stations: Macro base stations, pico base stations, O-RAN Radio Units (RU), supporting Massive MIMO

Phased Array Radar and Military Electronics: Industrial-grade temperature range makes it suitable for vehicle-mounted, airborne, and shipborne radar systems

Software-Defined Radio (SDR): Multi-mode, multi-band radio platforms

Satellite and Broadband Communications: DOCSIS 3.1/4.0, fiber optic communications

Test and Measurement Instruments: High-speed data acquisition and processing

Industrial Automation: High-speed motion control, machine vision

Supplier Profile: About Mingjiada Electronics (Shenzhen)

https://www.integrated-ic.com/

Shenzhen Mingjiada Electronics Co., Ltd. was established in 1996 and is headquartered at Rooms 1239-1241, Building B, Guoli Tower, Phase II of New Asia, Zhenzhong Road, Futian District, Shenzhen. It is a well-known hybrid distributor of electronic components in China.

Why Choose Mingjiada?

Certifications: Certified under ISO 9001:2014 Quality Management System and ISO 14001:2014 Environmental Management System, ensuring quality assurance;

Warehousing and Quality Inspection: Modern warehouses in both Hong Kong and Shenzhen; all incoming materials undergo rigorous testing against original manufacturer standards, guaranteeing 100% genuine products;

Service System: We support nationwide on-site pickup and inspection, as well as electronic signature confirmation and cash-on-delivery (COD);

End-to-End Service: We not only supply the XCZU21DR but also provide complementary components such as power management devices, memory, and connectors, offering a one-stop BOM (Bill of Materials) fulfillment service.

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Model: XCZU21DR-2FFVD1156I

Brand: Xilinx

Package: FCBGA-1156 (FFVD1156)

Lot Number: 23+ / New Batch

Temperature Grade: Industrial Grade I (-40°C to +100°C)

Availability: In Stock, Ready to Ship