Mingjiada Electronics Recycles 3D Time-Of-Flight Sensors, Recycle Image Sensors
Shenzhen Mingjiada Electronics Co., Ltd. – With many years of experience in the electronic component recycling sector, we boast a professional evaluation team, a global recycling network and standardised transaction processes. We have long specialised in the recycling of 3D ToF image sensors from various brands, and are committed to helping our clients utilise their inventory, reduce costs and achieve the circular use of resources.
Mingjiada consistently recycles the following categories of 3D ToF image sensors and related products:
3D ToF image sensors (all brands and package types)
Radar sensors (millimetre-wave radar, 77GHz automotive radar, etc.)
CMOS image sensors (global shutter/rolling shutter)
Sensor signal conditioners, proximity sensors, ambient light sensors
MEMS microphones, magnetic sensors, current sensors, pressure sensors, etc.
Our recycling process is straightforward and efficient: clients provide inventory details via email or telephone → the company provides a rapid valuation and quotation → on-site/ post inspection → Contract signing → Cash/wire transfer settlement.
Overview of Mingjiada Electronics’ sensor product recycling range:
1. Infineon — REAL3™ Series
Infineon’s REAL3™ series of ToF 3D imaging sensors, with their exceptional depth perception capabilities, are widely used in smartphone facial recognition, robot navigation, AR/VR, security surveillance and automotive smart cockpits. Based on Infineon’s proprietary time-of-flight technology, the REAL3™ series enables the smallest depth-sensing 3D camera modules on the market.
Mingjiada Electronics specialises in the recycling of the following Infineon ToF sensor models:
Automotive-grade applications: IRS2877AXUMA1, IRS2877ASXUMA1
Consumer/industrial applications: IRS2875CX1SA1, IRS2877CX1SA1, IRS2975CX1SA1, IRS2976CX1SA1, as well as IRS2381C, IRS1125C, IRS1645C, etc.
2. Sony — DepthSense® Series
Sony collectively refers to its range of distance-measuring sensors utilising ranging technology as the DepthSense® series, which is currently one of the most technically mature ToF product lines on the market. Sony offers a comprehensive product portfolio covering short, medium and long ranges, as well as both dToF and iToF technology approaches.
Mingjiada’s recovery models include:
IMX560: SPAD dToF sensor, 597×168 effective pixels, approximately 100,000 SPAD pixels, maximum frame rate of 100 fps, supports MIPI CSI-2 interface
IMX556: iToF sensor, 642×484 effective pixels (approximately 300,000 pixels), 1/2-inch optical format
IMX570: iToF sensor, 648×488 effective pixels (approx. 300,000 pixels), ultra-compact 1/4.5-inch package, pixel size of just 5µm×5µm
3. visionICs – VI4310/VI4320/VI4330
Mingjiada Electronics provides a long-term, stable supply of and accepts returns for the three 3D ToF image sensors: VI4310, VI4320 and VI4330. These devices utilise advanced SPAD detector arrays and direct time-of-flight technology to directly output centimetre-level precision 3D point cloud data and depth maps without the need for an external ISP, offering the advantages of high performance, low cost and high integration.
The detailed specifications of the three products are as follows:
VI4310 – 160×120, approx. 19K-pixel SPAD, CoB packaging, cost-effective entry-level model, 30 frames per second, suitable for mid-to-low-end 3D imaging applications.
VI4320 – 256×64 Approx. 16K-pixel SPAD, CoB packaging, specialised elongated array, suitable for linear scanning scenarios, supports 4×2 pixel binning.
VI4330 – 320×240 Approx. 76.8K-pixel SPAD, CoB packaging, flagship high-resolution model, supports MIPI-CSI2 interface, supports 2×2/4×4 pixel binning.
If you have surplus stock of 3D ToF image sensors (including but not limited to the brands and models listed above), please visit the Mingjiada Electronics website (https://www.integrated-ic.com/) for a free evaluation and quotation.
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